1. Single sided thermoelectric separation copper substrate PCB
Single sided thermoelectric separation copper substrate PCB product introduction:
The thermal conductivity of copper in the manufacturing process of metal core PCB is as high as 384w/(m · k), and thermoelectric separation overcomes the shortcomings of insufficient thermal conductivity and heat dissipation in existing single-sided copper substrates. Heat refers to a thermal conductive pad (PAD), while electricity refers to the positive and negative electrodes. The two are separated by insulating materials to form a specialized thermal conductive pad. The function of the thermal conductive pad is to conduct heat, and the main function of the electrodes is to conduct electricity. This packaging method is called thermoelectric separation, which has many advantages, mainly because it is convenient in the heat dissipation design of LEDs. The large area of exposed copper in the figure is designed as a large boss, which is directly copper based and in direct contact with the heat sink, conducting heat out, greatly improving the heat dissipation effect. This single sided thermoelectric separation product effectively solves the problems of heat generation and light efficiency in the use of automotive lamps, with the advantages of fast heat dissipation, high brightness, and energy conservation.
The formation process of thermoelectric separation copper substrate PCB includes: sticking a protective film on one side of the copper substrate; By using circuit board technology to form anti etching ink, exposure and development etching processes, the heat dissipation area is raised, with a height equal to the thickness of the insulation layer and circuit layer; By stacking the circuit layer (copper foil) and insulation layer (non adhesive semi cured sheet) together; Open windows in the heat dissipation area of the circuit layer and insulation layer, which can be opened using mold punching or CNC forming processing methods; Press the heat dissipation layer, circuit layer, and insulation layer (non adhesive epoxy semi cured sheet) together by hot pressing; The circuit layer circuit can be produced according to the circuit board processing process, which can form the thermoelectric separation copper substrate provided by the utility model. The thermoelectric separation production is suitable for matching with a single high-power lamp bead, especially COB packaging, to achieve better results for the lamp.
The disadvantage of thermoelectric separation copper substrate PCB is that it is not suitable for single electrode chip bare crystal packaging.
The thermoelectric separation copper substrate PCB structure is suitable for the heat dissipation of high-frequency circuits, areas with high and low temperature changes, and precision communication equipment, as well as the building decoration industry, as well as automotive LED lights, miner‘s lights, and stage lights. Exposure equipment in industrial equipment and the heat dissipation plate of mining machines are all involved in applications.
The thermoelectric separation copper substrate PCB is divided into single-sided thermoelectric separation copper substrate PCB and double-sided thermoelectric separation copper substrate PCB. Now, we are introducing the single thermoelectric separation copper substrate PCB
2. Structure diagram of thermoelectric separation copper substrate PCB product:
3. Front and back schematic diagram of thermoelectric separation copper substrate PCB product:
4. Copper substrate PCB product production and production process manufacturing instructions:
a) Substrate: Red copper (C1100)
b) Thickness: 0.4-5.0MM
c) Thermal conductivity (dielectric layer) 0.8/1.5/2.0/3.0 W/m.K.W
e) Copper foil thickness: 1/2/3/4 OZ
f) Solder resistance color: white/black/matte black/red/green/blue/matte green
d) Character color: white/black/orange/red/blue
f) Forming method: CNC gongs, CNC V-cutting, mold forming, laser cutting and milling
g) Surface treatment process: Lead sprayed tin, lead-free sprayed tin, chemical gold precipitation (gold thickness 0.5U "~3.0U"), chemical nickel palladium gold OSP
h) Delivery time: 5-6 days.
5. Copper substrate PCB product application scenarios:
Flashlights, industrial mining lights, automotive LED lights, UV lights, stage projection lights, 5G communication, wall washing lights, LED street lights, mechanical equipment, and various precision and high demand heat dissipation lighting instruments
6. Advantages of copper substrate PCB products:
Long service life, efficient heat dissipation, stable performance, and wide application range
7.FAQ
Q1. Are you a PCB manufacturer? Do you have a factory?
Answer: We are a professional manufacturer of printed circuit boards for over 12 years. We have factories and machines, and you can see pictures of our factories.
Q2. Can I obtain PCB samples for free? Can you deliver the goods free of charge?
Answer: Yes, we can provide you with a free PCB sample after discussing and confirming all the detailed information. But we do not provide free delivery services. If you purchase a large quantity of products, we will give you some discounts.
Q3. Do you do OEM?
Answer: Yes. We are a manufacturer of printed circuit boards, and we have factories and dedicated automation equipment for the entire process of PCB and PCBA, providing precise inspection and shipment. We provide one-stop procurement services for PCB and PCBA.
Q4. Can we produce a PCB with two layers of thermal conductive pads in direct contact with the substrate, while the electrodes are on the other layer?
Answer: Yes, we can produce PCBs with 2-layer thermal conductive pads that come into direct contact with the substrate. We call them 2-layer thermoelectric separation copper substrates. You can see our product drawings or send Gerber information to our email pcb@jbmcpcb.com Confirm.
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